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 TB6598FN/FNG
TENTATIVE
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB6598FN/FNG
Dual Full-Bridge Driver for Stepping Motors
The TB6598FN/FNG is a 2-phase bipolar stepping motor driver employing an LDMOS structure with low ON-resistance for output drive transistors. By applying four input signals (EN1, EN2, IN1, IN2), it is possible to control the rotation direction (forward/reverse) of 2-phase/1-2-phase stepper motor. It is also possible to achieve constant-current drive (PWM chopper drive).
Features
* * * * * * * * Motor supply voltage: VM 15 V (max) Control supply voltage: VCC = 2.7 V to 6 V Output current: Iout 0.8 A (max) Low ON-resistance: 1.5 (upper side + lower side typ. @ VM = 5 V) Constant-current control (PWM chopper drive) Standby (power-saving) mode On-chip thermal shutdown circuit (TSD) Compact package: SSOP-16 TB6598FNG: TB6598FNG is a Pb-free product. The following conditions apply to solderability: *Solderability 1. Use of Sn-63Pb solder bath *solder bath temperature = 230C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature=245C *dipping time = 5 seconds *the number of times = once *use of R-type flux Weight: 0.07 g (typ.)
This product has a MOS structure and is sensitive to electrostatic discharge. When handling the product, ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. Install the product correctly. Otherwise, breakdown, damage and/or degradation in the product or equipment may result.
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Block Diagram
GND 5 EN1 8 EN2 9 IN1 10 IN2 11 Timing Logic Pre-Drive Control Logic 3 AO1 H-Bridge B 1 AO2 2 RFA 12 OSC TSD 16 BO1 Vlim 7 Timing Logic Vref 0.6 V Band Gap Pre-Drive H-Bridge B 14 BO2 15 RFB VCC 6 13 VM
OSC
Vref 4
Some functional blocks, circuits, or constants may be omitted or simplified in the block diagram for explanatory purposes.
Pin Functions
Pin Name AO2 RFA AO1 Vref GND VCC Vlim EN1 EN2 IN1 IN2 OSC VM BO2 RFB BO1 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Functional Description Output 2 (Ch. A) Winding current detection pin (Ch. A) Output 1 (Ch. A) Internal reference voltage Ground pin Small-signal power supply pin Winding current setting pin Enable input 1 Enable input 2 Control input 1 Control input 2 Internal oscillation frequency setting pin Motor power supply pin Output 2 (Ch. B) Winding current detection pin (Ch. B) Output 1 (Ch. B) Ch. B motor winding connection pin Connect an oscillator capacitor externally VM (ope) = 4.5 V to 13.5 V Ch. B motor winding connection pin VCC (ope) = 2.7 V to 5.5 V Icoil (A) = Vlimit (V)/external RF () Ch. A motor winding connection pin +0.6 V (typ.) Remarks Ch. A motor winding connection pin
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TB6598FN/FNG
Truth Table 1
EN1 (EN2) L H L H L Forward IN1 (IN2) * H AO1 (BO1) OFF L AO2 (BO2) OFF H Mode ALL OFF Reverse
"*" indicates "don't care."
Truth Table 2
EN1 L L H H (Note) EN2 L H L H Operation (Note) Mode Standby
Note: VINL (EN1 = EN2) < 0.5 V. =
Operating Description
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
VCC 115uA 20 uA
t2
1.2 V
Charge ON OSC 40 k
Cosc
Discharge ON 115 uA
0.8 V
Oscillator circuit
20 k
t1
Vosc waveform
* The internal oscillation frequency is determined by charging and discharging an external capacitor (Cosc).
Vosc =
1 i dt , Cosc
Vosc = Ix (t1 - t2)/Cosc,
I , VoscCosc 1 I fosc = = , 2 (t1 - t2) 2 VoscCosc 1 1 theoretical formula. = = 2 x 0.4/115 A x Cosc 6.957 x 10 3 x Cosc
1 t1 - t2
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* Chopper control The winding current flows while the output drive transistor is On. When the VRF reaches the limit voltage level (Vlimit), the comparator detects it and turns off the output drive transistor. The oscillator output is squared to generate an internal clock. The off timer starts on the edge of the internal clock and is active for two internal clocks. When the off timer stops, the PWM goes high.
osc Internal clock Off timer 2-bit counter PWM output V limit
Winding current
chop on
*2
*1
*2
*1
*2
*1
*2
*1
*1: Increase of current *2: Chopping of current
The PWM control limits the winding current to a level determined by the current value (IO) as expressed in the equation below: IO = Vlimt/RNF. * PWM control function When PWM control is provided, normal operation and short brake operation are repeated. To prevent penetrating current, dead time t2 and t4 are provided in the IC.
VM
M
M
M
RF t1 t2 = 400 ns (typ.) t3
M
M
t4 = 400 ns (typ.)
t5
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TB6598FN/FNG
Maximum Ratings (Ta = 25C)
Characteristics Power supply voltage Symbol VM VCC Input voltage Output current Power dissipation Operating temperature Storage temperature VIN IOUT PD Topr Tstg Rating 15 6 -0.2 to 6 0.8 0.78 (Note 1) -20 to 85 -55 to 150 V A W C C IN1, IN2, EN1 and EN2 pins Unit V Remarks
Note 1: When mounted on a glass-epoxy PCB (50 mm x 30 mm x 1.6 mm, Cu area: 40%)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed. Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. Applications using the device should be designed so that no maximum rating will ever be exceeded under any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this document.
Operating Range (Ta = -20 to 85C)
Characteristics Power supply voltage (VCC) Power supply voltage (VM) Output current Limit voltage OSC frequency Chopping frequency Symbol VCC VM IOUT Vlimit f osc fchop Min 2.7 2.5 GND 20 Typ. 3 5 Max 5.5 13.5 0.6 Vref 1 250 Unit V V A V MHz kHz
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Electrical Characteristics (unless otherwise specified, VCC = 3 V, VM = 12 V, Ta = 25C)
Characteristics Symbol Test Circuit 1 1 1 1 1 1 Test Condition 1ch ON EN1 = 0.8 V, EN2 = 2.0 V 2ch ON EN1 = EN2 = 2.0 V Standby mode EN1 = EN2 = 0.5 V 1ch ON, Output open EN1 = 0.8 V, EN2 = 2.0 V 2ch ON, Output open EN1 = EN2 = 2.0 V Standby mode EN1 = EN2 = 0.5 V Min Typ. Max Unit
ICC1 ICC2 ICC3 Supply current IM1 IM2 IM3 VINH Input voltage VINL1 VINL2 Control circuit Hysteresis voltage Input current VIN (HIS) IINH IINL Output saturating voltage Output constant-current detection level Reference voltage Reference voltage current capacity Input current at winding current setting pin Output leakage current Vsat (U + L) VRF Vref Iref IIN (limit) IL (U) IL (L) Diode forward voltage Oscillation frequency Capacitor charge current Capacitor discharge current Thermal shutdown circuit operating temperature Thermal shutdown hysterisis VF (U) VF (L) f osc IC1 IC2 TSD TSD
2 -0.2
1.4 1.4 7 1.9 1.9 0.2 15 0.3 0.9 0.6 0.6 1 1 530 115 115 170 20
3 3 15 3.0
mA mA A
mA 3.0 1 VCC + 0.2 0.8 V 0.5 A
2 2 2 2 2 3 4 5 5 6 7 7 8 9 10 11 11 (Design target value) Standby mode (Design target value) VIN = 3 V VIN = GND IO = 0.2 A IO = 0.6 A RRF = 0.1 , Vref = 0.6 V No load Source (Vref = 50 mV) Vlimit = GND VM = 15 V IO = 0.6 A IO = 0.6 A Cosc = 220 pF Vosc = 0 V Vosc = 2 V
-0.2 5 0.565 0.57 430
30
1 0.4 1.2 0.635 0.63 100 1 1 1 1.2 1.2 630 kHz A A C C V V V A A A A A V
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Test Circuit 1: ICC1, ICC2, ICC3, IM1, IM2, IM3
1 AO2 2 RFA 3 AO1 4 Vref 1 5 GND 6 VCC ICC A 8 EN1 3.0 V 0.8 V, 2.0 V, 0.5 V 7 Vlim
BO1 16 RFB 15 BO2 14 IM OSC 12 IN2 11 IN1 10 EN2 9 2.0 V, 2.0 V, 0.5 V 1 VM 13 A 12 V
ICC1, IM1: EN1 = 0.8 V, EN2 = 2.0 V ICC2, IM2: EN1 = 2.0 V, EN2 = 2.0 V ICC3, IM3: EN1 = 0.5 V, EN2 = 0.5 V
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Test Circuit 2: VINH, VINL1, VINL2, IINH, IINL
100 k 100 k 100 k VB02 100 k 100 k 1
100 k
VA01
VA02
VB01
100 k
100 k
1 AO2 2 RFA 3 AO1 4 Vref 1 5 GND 6 VCC 7 Vlim 3.0 V 8 EN1
BO1 16 RFB 15 BO2 14 VM 13 12 V OSC 12 IN2 11 IN1 10 EN2 9
IINL
A
A
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VINH
VINL
IINH
TB6598FN/FNG
Test Circuit 3: VSAT (U + L)
VO (Note1) VO (Note1) 1 AO2 RL (Note2) V 2 RFA 3 AO1 4 Vref 5 GND 6 VCC 7 Vlim 8 EN1 3V BO1 16 RFB 15 BO2 14 VM 13 OSC 12 IN2 11 IN1 10 EN2 9 RL (Note2) V
Note1: VSAT (U + L) =12 - VO Note2: Calibrate IO to 0.2 A / 0.6 A by RL.
Test Circuit 4: VRF
5 mH 1 AO2 1 1 2 RFA 3 AO1 4 Vref 5 GND 6 VCC 7 Vlim 8 EN1 BO1 16 RFB 15 BO2 14 VM 13 220 pF OSC 12 IN2 11 IN1 10 EN2 9 1 1 5 mH
V
12 V
V
12 V
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Test Circuit 5: Vref, Iref
1 AO2 2 RFA 3 AO1 SW (Note) 0.1 F 4 Vref 5 GND 6 VCC 100 A 7 Vlim 8 EN1 3V BO1 16 RFB 15 BO2 14 VM 13 220 pF 12 V OSC 12 IN2 11 IN1 10 EN2 9
Vref
Note: 1. Vref: SW = OFF 2. Iref: The Vref voltage descent at the time of SW = ON checks below 50 mV.
Test Circuit 6: IIN (limit)
1 AO2 2 RFA 3 AO1 4 Vref 5 GND 6 VCC 7 Vlim 8 EN1 A 3V BO1 16 RFB 15 BO2 14 VM 13 OSC 12 IN2 11 IN1 10 EN2 9
12 V
V
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TB6598FN/FNG
Test Circuit 7: IL (U), IL (L)
IL (U) IL (U) IL (U) IL (U)
A
A
A
A
IL (L)
IL (L)
IL (L)
A
A
1 AO2 2 RFA 3 AO1 4 Vref 5 GND 6 VCC 7 Vlim 8 EN1
BO1 16 RFB 15 BO2 14 VM 13 220 pF OSC 12 IN2 11 IN1 10 EN2 9
A
A
Test Circuit 8: VF (U)
1 AO2 2 RFA 0.6 A 3 AO1 4 Vref 5 GND 6 VCC 7 Vlim 8 EN1 BO1 16 RFB 15 BO2 14 VM 13 OSC 12 IN2 11 IN1 10 EN2 9 V 0.6 A
V
IL (L)
15 V
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TB6598FN/FNG
Test Circuit 9: VF (L)
1 AO2 0.6 A 2 RFA V VF (L) 3 AO1 4 Vref 5 GND 6 VCC 7 Vlim 8 EN1 RFB 15 BO2 14 VM 13 OSC 12 IN2 11 IN1 10 EN2 9 V VF (L) BO1 16 0.6 A
Test Circuit 10: fOSC
1 AO2 2 RFA 3 AO1 4 Vref 5 GND 6 VCC 7 Vlim 8 EN1 3V BO1 16 RFB 15 BO2 14 VM 13 220 pF OSC 12 IN2 11 IN1 10 EN2 9
F.C
12 V
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TB6598FN/FNG
Test Circuit 11: IC1, IC2
12 V IC2 IC1 A A 0.65 V 1.35 V 1 AO2 2 RFA 3 AO1 4 Vref 5 GND 6 VCC 7 Vlim 8 EN1 BO1 16 RFB 15 BO2 14 VM 13 OSC 12 IN2 11 IN1 10 EN2 9
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TB6598FN/FNG
Application Circuit Example
3V VDD
3 V to 5 V
(Note 1) VM
(Note 1)
VM
VCC
AO1 M EN1 EN2 MCU IN1 IN2 TB6598FNG BO1 M BO2 RFB AO2 RFA
GND
GND
Vref
Vlim
OSC (Note 1)
(Note 1)
Note 1: Noise suppression capacitors and oscillator capacitors should be connected as close as possible to the IC.
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TB6598FN/FNG
Package Dimensions
Weight: 0.07 g (typ.)
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TB6598FN/FNG
Notes on Contents 1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Maximum Ratings
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed. Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. Applications using the device should be designed so that no maximum rating will ever be exceeded under any operating conditions. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this document.
5. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required in the mass production design phase. In furnishing these examples of application circuits, Toshiba does not grant the use of any industrial property rights.
6. Test Circuits
Components in test circuits are used only to obtain and confirm device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure in application equipment.
Handling of the IC
Ensure that the product is installed correctly to prevent breakdown, damage and/or degradation in the product or equipment.
Overcurrent Protection and Heat Protection Circuits
These protection functions are intended only as a temporary means of preventing output short circuits or other abnormal conditions and are not guaranteed to prevent damage to the IC. If the guaranteed operating ranges of this product are exceeded, these protection features may not operate and some output short circuits may result in the IC being damaged. The over-current protection feature is intended to protect the IC from temporary short circuits only. Short circuits persisting over long periods may cause excessive stress and damage the IC. Systems should be configured so that any over-current condition will be eliminated as soon as possible.
Counter-Electromotive force
When the motor reverses or stops, the effect of counter-electromotive force may cause the current to flow to the power source. If the power supply is not equipped with sink capability, the power and output pins may exceed the maximum rating. The counter-electromotive force of the motor will vary depending on the conditions of use and the features of the motor. Therefore make sure there will be no damage to or operational problem in the IC, and no damage to or operational errors in peripheral circuits caused by counter-electromotive force.
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TB6598FN/FNG
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
030619EBA
* The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations.
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